Study on cooling technology of high heat flux data center using chip water cooling and gravity heat pipe

Constructs a heat transfer path from server chip to cold water loop and then from refrigerant loop to cooling tower loop. Heat is tranferred from server chip by a piezoelectric pump driven water loop, then into a gravity heat pipe loop which connects indoor servers and outdoor cooling tower and finally released into outdoor environment by cooling tower. There is no air in the entire heat transfer path, which effectively reduces thermal resistance, raises the output water temperature of cooling tower and increases free cooling potential. Test results and theoretical analysis show that the annual average energy efficiency ratio (EER) of a large data center using this cooling system without chillers and airconditioners can be as high as 8 to 11. In addition, more indoor space can be utilized due to the nonair flow design, which allows more server racks arrangement, less building area demand and further decrease of initial investment and operation cost.